Low-Viscosity Hot Melt Targets Small-Gap Protection in Electronic Assemblies
Henkel has introduced Technomelt PA 6370, a new polyamide-based hot melt adhesive developed for encapsulating electronic components with narrow gaps and complex geometries.
According to the company, the material is designed to fill gaps as small as 0.5 mm, which may make it suitable for assemblies where complete coverage is needed in confined spaces. Henkel stated that the formulation’s low melt viscosity is intended to support penetration, wetting, and adhesion on multiple substrates.
For manufacturers, the material is positioned around processing speed as well as environmental protection. Henkel reports that electronic parts can be encapsulated in three steps with low application pressure and cycle times as short as 30 seconds. The company also stated that the material maintained adhesion performance after prolonged exposure to heat and moisture and is designed to resist water, salt fog, humidity, corrosion, and temperature aging.
Henkel said Technomelt PA 6370 provides electrical insulation, meets UL 94 V-0 flame retardancy requirements, and maintains dimensional stability across an operating range of -20°C to 140°C. Potential uses identified by the company include motors, connectors, sensors, printed circuit boards, and other electronics used in harsh operating environments.
Justin Kolbe of Henkel said the new formulation is intended to give manufacturers additional options for protecting intricate electronic assemblies while maintaining throughput and environmental resistance.
Source: Henkel