Gelest Breaks Ground on New Production Facility
Gelest, Inc. has broken ground on a new 50,000 square-foot building located at Gelest’s global headquarters in Morrisville, PA. It is slated for completion by September 2024.
Jonathan Goff, Vice President of the Custom Synthesis Division for Mitsubishi Chemical Group and President of Gelest, shared, “We are leveraging the technical expertise of the local workforce and recruiting from local universities. In addition, we are supporting the trend towards on-shoring business, thereby fortifying the U.S. supply chain for crucial materials for advanced manufacturing.” The new facility will enhance Gelest’s production capabilities, supporting a diverse range of customer applications, from microelectronics and medical devices to advanced thermal coatings and mobility. As part of a strategic collaboration with Lam Research Corp., Fremont, Calif., Gelest will develop and manufacture precursor chemicals for use in Lam’s breakthrough dry photoresist technology for EUV lithography. Dry resist EUV technology is an advanced semiconductor manufacturing technique poised to propel the next generation of logic and DRAM technologies for the semiconductor market. This precursor production will be a key technology operated at a commercial scale in the new building, ensuring a robust supply.
Source: Gelest, Inc.